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XIAO 보드용 GPIO 확장 모듈 -16 GPIO, MCP23017
(IO Expander for XIAO - 16 extra IO)
개요
- 본 제품은 XIAO 보드용 GPIO 확장 모듈 -16 GPIO, MCP23017 입니다.
- MCP23017 칩을 기반으로 디자인된 제품으로 XIAO 보드의 GPIO를 추가로 16개 확장할 수 있도록 하여 준 제품입니다.
- 25mA 까지 전류 출력이 가능하며, 입력 모드는 풀업 설정이 가능합니다.
특징
- Solder pads expansion board: Powered by the MCP23017, it provides solderable 16 extra IOs, 2 power output, 1 Grove IIC bus port, along with extra output pads, including GND, INTB, INTA, and RST
- I2C Interface with configurable address: Default I2C address is 0x21, but can be configured to 0x20, which allows dual expansion boards working at the same time
- Designed for Seeed Studio XIAO: Highly compatible with all XIAO series products, highly expand your current project
- Solder-friendly: Multiple solder pads, every function solderable, compatible with bread board
- Thumb-sized Compact Design: 21 x 17.5mm, adopting the classic form factor of XIAO, suitable for space limited projects like wearable devices
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No.
Pad/Pin
Description
0
Standard XIAO Pads
These are the standard pads for connecting the XIAO microcontroller.
1
J1 pads
Allows connection between MCP23017's RST, INTB, and INTA pins to XIAO's D6, D1, and D0 pins
2
MCP23017 Chip
Main I/O expander chip, provides 16 additional IOs
3
J2 pads
For selecting the I2C address. Default is 0x21. Changing to 0x20 is possible by soldering
4
MCP23017 Output Pins
Output pins from MCP23017 chip, labeled PA0 to PB7, providing 16 IOs
5
Grove Pads
For connecting Grove modules via soldered Grove socket. Connected to I2C bus
6
VCC Pin
Output pin for powering other components
7
GND Pin
Output pin for grounding other components
8
Additional Output Pads
Extra output pads, including GND, INTB, INTA, RST. Can be soldered for use elsewhere
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IO Expander for XIAO is a solderable expansion board that perfectly matches Seeed Studio XIAO series, designed to expand the connectivity and enhance the functionality.
Powered by the MCP23017, it utilizes IIC port with high communication of 400 kHz, to break out additional solderable 16 extra IOs, where they can output up to 25mA and the input mode can be configured to pull up. Meanwhile, it also provides 2 power outputs (2 VCC and 2 GND), 1 Grove IIC bus port, along with extra output pads, including GND, INTB, INTA, and RST.
This board also provides J1 pads and J2 pads where J1 pads allow the pins RST, INTB, and INTA of the MCP23017 chip to be connected to the pins D6, D1, and D0 of the XIAO board, and J2 Pads pads are used for selecting the IIC address of the MCP23017 chip. The selectable II2 address ensures one Seeed Studio XIAO board can connect with two IO Expander boards, to have a total 32 IOs for extensive application.
The expansion board features Grove pads that are designed for connecting Grove modules using soldered Grove sockets. These pads are connected to the I2C bus, enabling seamless integration with compatible Grove modules.
It adopts XIAO 21 x 17.5mm compact design, everything is solderable and would be perfect for solder enthusiasts.
