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HiKey 960 - 안드로이드 AOSP 개발보드
(HiKey 960 Development Board)
개요
- 본 제품은 화웨이사의 Kirin 옥타코어 ARM big.LITTLE 프로세서( four ARM Cortex®-A73 and four Cortex-A53 cores with 3GB of LPDDR4 SDRAM memory, 32GB of UFS 2.0 flash storage, and the latest generation Mali™ G71 MP8 graphics processor.)를 장착한 안드로이드 개발보드입니다.
- 지원되는 소프트웨어는 리눅스 커널 4.4를 사용한 안드로이드 공용 커널을 기반으로한 AOSP(Android Open Source Project ) 소스 트리입니다.
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특징
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SoC Kirin 960 SoC CPU 4*Cortex A73 (up to 2.3GHz) + 4*Cortex A53 (up to 1.8GHz) Big.LILLTE CPU architecture GPU ARM Mali G71 MP8, up to 900MHz RAM 3GB LPDDR4 SDRAM @ 1866MHz PMU Hi6421GWCV530 Hi6422GWCV211 Hi6422GWCV212 Sizes 85mm x 55mm
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Storage 32GB UFS flash storage MicroSD card slot (SD3.0, SDR104, up to 2TB)
PCIE PCIE Gen2 on M.2 M Key connector Wireless WiFi (2.4- and 5-GHz dual band with two antennas)
Bluetooth 4.1
USB 2 x USB 3.0 type A (host mode only) 1 x USB 2.0 type C OTG
Display 1 x HDMI 1.4 (Type A - full, up to FHD 1080P)
1 x 4L-MIPI DSI (Supports up to 3840 * 2400 @ 60Hz dual MIPI DSI interface LCD screen)
Video 4K @30fps H.265/H264 video hardware encoder
H265\HEVC MP/High Tier, Main/High Tier, H.264 BP/MP/HP, MPEG 1/2/4, VC-1, VP6/8, RV8/9/10, DIVX, H265 up to 4K @60fps video hardware decoder
Audio HDMI output
1 x Tensilica HiFi3.0 DSP audio subsystem
Camera 1 x WiFi activity LED（Yellow） 1 x BT activity LED (Blue)
4 x User LEDs (Green)
Button Power Button ： Button Power on/off & Reset the system Power Source Recommend a 12V@2A adapter with a DC plug which has a 4.75mm outer diameter and 1.7mm center pin with standard center-positive (EIAJ-3 Compliant) OS Support AOSP/LINUX
